Through-hole technology promises smaller mobile phone cameras

Back view of image sensor using through-hole technology

Article Summary

November 9, 2007 Oki has developed a new manufacturing technique that makes it possible to further miniaturize camera modules for mobile phones. The company announced it has started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors using through-hole technology - a process which can halve the size of conventional camera modules.

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