Mobile device imaging sensor manufacturer OmniVision has announced the development of a slim CMOS camera sensor based on its 1.1-micron, backside-illuminated pixel architecture
Smaller camera phones are on the horizon thanks to the development of a new backside-illuminated CMOS sensor, from mobile device imaging sensor manufacturer OmniVision. The OV8850 is said to be 20 percent thinner than any other 8 megapixel module currently on the market, and promises better quality images while also making improvements in power efficiency. The company's announcement has also added even more fuel to the iPhone 5 rumor mill.
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