Keeping hybrids cool under the bonnet reaches boiling point
Purdue University's Tannaz Harirchian and Professor Suresh Garimella have developed a new means of cooling chips in electric and hybrid applications (Photo: Andrew Hancock)
As an increasing number of hybrid-powered vehicles move from concept to completion, technology is battling to keep pace with some of the less-publicized technical challenges found among the complex electronics aboard these land- and air-based vehicles, computers and other devices. For instance, how do you effectively cool the electronics in a high-power electric motor that propels a passenger car from 0-60mph in under 10 seconds and uses regenerative braking to stop? Researchers in the U.S. believe the secret may lie in understanding precisely how fluid boils in tiny ‘microchannels’, which has led them to develop formulas and models that will help engineers design unique systems to cool high-power electronics found in today’s and tomorrow’s devices.
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