USB 3.0 on the horizon

September 23, 2007 Details of the proposed next generation of high-speed USB (Universal Serial Bus) connectors have been unveiled. The planned USB 3.0 system will target a transfer speed of 4.8 gigabits per second, ten times that of USB 2.0 models. Intel, Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors have formed the USB 3.0 Promoter Group to make the high-speed connection a reality, with final USB 3.0 specification scheduled to be released in the first half of 2008 and backward-compatible products hitting shelves as early as 2009.

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