A classic , "2D" multicore chip design.
In 3D chips, the cores are stacked to reduce wire lengths and improve communication speeds.
We've seen vertically oriented transistors, now it's time for entire chips to explore the z-axis. Collaborating with Swiss research institutes EPFL and ETH Zurich, IBM has made another important step toward creating faster, higher-efficiency "3D" processors stacking their cores vertically to increase the number of interconnections and sensibly reduce heat.
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